59 -- INDUCTIVELY COUPLED PLASMA SOURCE

The U.S. Department of Commerce, National Institute of Standards & Technology (NIST) proposes to negotiate on a sole source basis contract under the authority of 41 U.S.C. 253(c)(1) with Trion Technology for an inductively coupled plasma (ICP) source unit that will enhance the use of a recently purchased reactive ion etching (RIE) system (Minilock-Phantom III). The compact, vacuum load-locked reactive ion etcher (RIE) is designed to supply research and failure analysis labs with state-of-the-art plasma etch capability using single wafers (up to 200mm), dies or parts. Samples are loaded into the process chamber via the vacuum load-lock. This feature increases user safety by preventing contact with the process chamber and any residual etch by-products. The load-lock also allows the chamber to remain permanently under vacuum thereby keeping out moisture and keeping the reaction chamber free of possible corrosion. The ICP source will result in improved etch rates and profile control, improved uniformity, greatly increased selectivity and a dramatic reduction in radiation damage and contamination from RIE sputtering. Some applications benefiting from this technology are oxide, III-V materials, polyimide, polysilicon and active devices which are affected by radiation.This procurement is being conducted per FAR Part 13.1, Simplified Acquisition Procedures (under $100K). This notice is for information purposes only. No competitive solicitation is planned. Trion Technology is currently assembling our Minilock-Phantom III RIE system and the use of another vendor ICP source unit would make the warranty void on the RIE system. Trion's computer control and software for the Minilock-Phantom III is also incompatible with ICP source units from other vendors. Information submitted in response to this notice will be used solely to determine whether or not use of competitive procedures to fulfill this requirement would be in the Government's best interest and must address qualifications pertinent to this requirement. All technical questions must be submitted in writing to the Contracting Officer by e-mail before June 15, 2007. Anticipated award date will be June 18, 2007.