A -- Developments at NIST

Researchers at the National Institute of Standards and Technology (NIST) are working on the following technologies. FOR FURTHER INFORMATION, CONTACT THE: NATIONAL INSTITUTE OF STANDARDS AND TECHNOLOGY, OFFICE OF TECHNOLOGY PARTNERSHIPS, 100 BUREAU DRIVE, STOP 2200, GAITHERSBURG, MARYLAND 20899; FAX: 301-869-2751. This is not an announcement of a contract action or a grant. *** NIST DOCKET NUMBER: 02-011US Title: Superconformat Metal Deposition Using Derivitized Substrates Description: A two-step process for depositing seam-free and void-free metal metallization for use as conductors in microelectronics has been developed. Superconformal metal deposition in features, e.g., damascene process for filling trenches and vias on a patterned wafer, is achieved in an electrolyte that does not contain a deposition-rate increasing catalyst. The superfill process is accomplished by first adsorbing the catalyst onto the surface of the specimen by immersion in a catalyst-containing solution. After controlled adsorption of a submonolayer coverage of catalyst, metal deposition is then accomplished in a catalyst-free electrolyte that may contain metal deposition-rate inhibiting additives and/or levelers. ***