HPCMP Technical Insertion BOA On Ramp Opportunity

The US Army Corps of Engineers Research and Development Center (ERDC) is conducting market research for the on-ramping of additional firms to the High Performance Computing Modernization Program (HPCMP) Basic Ordering Agreeement (BOA) in support of Technical Insertion (Tl) requirements at its DoD Supercomputing Resource Centers (DSRCs). ERDC is requesting interested firms to submit a capabilities package in response to this announcement for review of possible market capabilities to perform its Tl requirements. The description of the work is provided below which also will include the delivery, assembly, acceptance testing of a fully operational system, system administration (if required in the overall Tl requirements) and hardware/software maintenance as specified in the individual Tl requirements. NOTE: System administration of the systems provided may or may not be required for all future requirements. System administration requirements will be identified in the specific order requirements as they materialize. Those firms that can provide the equipment/systems and provide hardware/software maintenance only, are encouraged to provide their capabilities statement to execute such requirements. ****For the systems to be procured for FY25, order requirements are projected to be the systems and hardware/software maintenance and system administration of those fully operational systems.