CORRECTION TO LINE ITEM NO. 0001 B) UV EXPOSURE SOURCE THE ILLUMINATION UNIFORMITY SHOULD READ +/- 5% OR BETTER OVER 6 INCH STREAMLINED SOLICITATION FOR COMMERCIAL ITEMS (Ref. FAR Part 12.603) 1. This is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice and in accordance with the simplified acquisition procedures authorized in FAR Part 13. This announcement constitutes the only solicitation; quotations are being requested and a written solicitation will not be issued. 2. This Solicitation No. RA134107RQ0797DR is issued as a request for quotation (RFQ). 3. The solicitation document and incorporated provisions and clauses are those in effect through Federal Acquisition Circular 2005-18. 4. This procurement is a Total Small Business Set-aside. The NAICS code for this procurement is 333295, Semiconductor Machinery Manufacturing. The small business size standard is 500. 5. Contract Line Items are as follows: CLIN NO. 0001; Quantity 1 Each; Mask/Bond Alignment & UV Exposure Tool, in accordance with the following specifications. CLIN NO. 0002; Quantity 1 Each; Option I - 4 inch Wafer Chuck CLIN NO. 0003; Quantity 1 Each; Option II - 6 inch Wafer Chuck CLIN NO. 0004; Quantity 1 Each; Option III - 4 inch Bond Chuck CLIN NO. 0005; Quantity 1 Each; Option IV - 6 inch Bond Chuck CLIN NO. 0006; Quantity 1 Each; Option V - 7 inch Mask Holder CLIN NO. 0007; Qunatity 1 Each; Option VI - Automatic alignment key acquisition and alignment CLIN NO. 0008; Quantity 1 Each; Option VII - Bond tool capable of bonding pre-aligned wafer pairs (from the mask/bond aligner) using anodic, thermo-compression, direct and adhesive bond techniques Max bond temp 550 oC Max bond pressure >3 kN Anodic bonding at 1200 V and 50 mA Vacuum <= 5E-3 mbar Pieces-6 inch wafers 6. REQUIREMENTS: a) We require a Mask/Bond Aligner and UV Exposure system for use in the Quantum Electrical Metrology Division of NIST. The system will be used to perform precision alignment of lithography masks to substrate wafers, UV exposure, and wafer-to-wafer precision alignment. Alignment shall be both front and backside. In addition, as an option separately quoted, we require a compatible bond tool capable of bonding pre-aligned wafers using thermo-compression, anodic, silicon fusion and adhesive techniques. b) The system shall meet Occupational Safety & Health Administration (OSHA) standards for operator safety and Semiconductor Equipment & Materials Standards (SEMI) for environmental safety. c) All equipment shall be Class 100 clean room compatible and designed to sit within the clean room. Minimum overall system footprint is important due to space constraints, provide system dimensions. Aligner shall be provided with vibration isolation frame/table. d) Equipment shall be a current year production model and not a prototype or one-of-a-kind system. There shall be at least 5 working units of the proposed make and model operating currently in the field. Any substitutions of normally used major system components, such as software, power supplies, and optics required to meet these specifications shall be clearly noted in the quotation. Line Item No. 0001 Specifications: -Mask/Bond Alignment & UV Exposure Tool: A) Mask-Wafer Alignment Specifications The tool shall be capable of aligning a transparent mask to alignment keys placed either the top or bottom surface of the wafer. Alignment shall be performed using top and bottom side split-field microscopes with high-resolution CCD cameras and remote display. Stages (x,y and z) and microscopes shall be fully motorized. System shall be capable of upgrade to automatic wafer load and fully automatic (computer controlled) alignment in the future without major modifications. - Mask size 4-7 inch. Provide tooling for 4 inch masks. - Wafer size: pieces to 6 inch wafers. Provide tooling for pieces - 3 inch. - Wafer thickness of up to 10 mm. - Mask and wafer chuck changeover for different sizes shall be simple and fast. - Alignment precision shall be <=0.5 microns using topside alignment and <= 1 micron using backside alignment. - Wafer load shall be manual and capable of aligning to flat of wafer. - Wafer chuck shall be provided with precision, low contact force wedge error correction to accommodate wafer-mask non-planarity. Describe WEC mechanism, wafer contact force and area. - Microscope objective spacing and travel sufficient to align small (10 mm) pieces up to 6 inch wafers and shall allow optical alignment to the wafer flat. Objectives provided shall be capable of resolving stated alignment precision. B) UV Exposure Specifications After mechanical alignment of mask and wafer, tool shall be capable of sub-micron resolution near-UV exposure through mask. - Required exposure modes: soft contact, hard contact, vacuum contact and proximity. - Describe resolution achievable in different modes. - Light source 365 nm (Hg i-line), minimum 12 mW/cm^2 at wafer. - Illumination uniformity <=5% over 150 mm wafer. - UV-LED light source preferable if above specifications can be met. C) Wafer-Wafer Alignment Specifications In addition to mask-to-wafer alignment, the tool shall also be capable of aligning both transparent-to-opaque and opaque-to-opaque wafer pairs. It shall be possible to align the top of the lower wafer to features on the backside of the upper wafer. The aligned wafer pair shall be securely clamped in a chuck fixture to allow transfer to a compatible bond tool (see Options, below). Bond chuck fixture and compatible bond tool (option) shall be capable of anodic, thermo-compression, direct and adhesive bonding. It shall be simple and fast to switch between mask-to-wafer and wafer-to-wafer alignment. - Wafer size 3 inch-6 inch. Provide bond chuck tooling for 3 inch wafers - Wafer-to-wafer alignment <=1 micron In addition, describe other alignment/registration capabilities for which the offered platform may be used for example, nano-imprint lithography, micro-contact printing, shadow mask alignment, etc. D) Controls, Instrumentation and Automation Specifications - Microscope (top and bottom) objective position and wafer alignment (x, y, z, theta) stage provided with motors controlled by software via joystick. Describe range and precision of all motions in the quotation. - Graphical user interface capable of storing alignment mark positions, exposure dosages, etc., and of controlling motorized components via joy stick control. -Software shall be upgradeable to fully automatic alignment key capture and alignment as well as automatic wafer loading from cassette to cassette. E) Installation, Documentation, Training and Warranty - System shall be provided with a complete set of electrical and mechanical schematics and a complete set of operations and maintenance manuals. All manuals shall be provided in electronic form. - The system shall be installed at the NIST Boulder Labs by the vendor in cooperation with NIST staff. - Operations and maintenance training for at least 3 NIST staff shall be provided within 10 days after completion of installation. - Warranty shall be for a period of 1 year after delivery, and include parts, labor and travel. F) Acceptance Testing After installation is complete, the contractor shall demonstrate/verify that tool meets all specifications and capabilities including: - Illumination intensity and uniformity; - Stage and optics range of motion; and - Front and back side alignment. 7. DELIVERY INFORMATION: Required Delivery: 160 days After Receipt of Order (ARO) Place of Delivery and Acceptance: NIST Boulder Labs, 325 Broadway, Bldg 22, Boulder, CO 80305. FOB Point: Destination 8. The Clause 52.252-2 Clauses Incorporated by Reference (FEB 1998) applies to this acquisition. This order incorporates one or more clauses by reference, with the same force and effect as if they were given in full text. Upon request, the Contracting Officer will make their full text available. Also, the full text of a clause may be accessed electronically at this/these address(es): www.arnet.gov/far. 9. The provision at 52.212-1, Instructions to Offerors-Commercial (SEP 2006), applies to this acquisition. 10. Provision 52.212-2, Evaluation-Commercial Items (JAN 1999), applies to this acquisition. Award will be made based to the Contractor whose quote offers the best value to the Government, price and other factors considered. The Government will evaluate quotations based on the following evaluation criteria: 1) Technical Capability, 2) Past Performance, and 3) Price. -Technical Capability - the RFQ shall address all requirements/specifications outlined above and shall provide indication of understanding and ability to meet requirements. 1.1 General under Requirements 1.2 Mask/wafer alignment capabilities (Line Item No. 0001 A) 1.3 Optics and light source (Line Item No. 0001 B) 1.4 Controls and automation (Line Item No. 0001 D) 1.5 Service and Support Organization (Line Item No. 0001 E) 1.6 Options (Line Items No. 0002,0003,0004) 1.7 Installation, Documentation and Warranty -Past Performance The proposal shall include no fewer than 3 references, including address, phone and fax numbers and point-of-contact, from users who are currently operating the make and model of the proposed system in the field. Referenced models need not be of the current production model year, but shall be production equipment manufactured within the past 24 months and designed for the purpose and functionally identical to the equipment described in this specification. Past performance will be evaluated in terms of quality, timeliness, and customer satisfaction. 11. A completed copy of the Provision 52.212-3, Offeror Representations and Certifications - Commercial Items (NOV 2006), must be included with each offer. 12. Clause 52.212-4, Contract Terms and Conditions -Commercial Items (FEB 2007), applies to this acquisition. 13. Clause 52.212-5, Contract Terms and Conditions Required to Implement Statutes or Executive Orders - Commercial Items (JUN 2007), applies to this acquisition. The following additional FAR clauses cited in the clause are applicable to this acquisition: 52.203-6 Restrictions on subcontractor Sales to the Government Alternate I (OCT 1995); 52.219-6 Notice of Total Small Business Set Aside (JUN 2003); 52.219-8 Utilization of Small Business Concern (MAY 2004); 52.219-14 Limitations on Subcontracting (DEC 1996); 52.219-28 Post Award Small Business Program Rerepresentation (JUN 2007); 52.222-3 Convict Labor (JUN 2003); 52.222-19 Child Labor (JAN 2006); 52.222-21 Prohibition of Segregated Facilities (FEB 1999); 52.222-26 Equal Opportunity (MAR 2007); 52.222-35 Equal Opportunity for Special Disabled Veterans, Veterans of the Vietnam Era, and other Eligible Veterans (SEP 2006); 52.222-36 Affirmative Actions for Workers with Disabilities (JUN 1998); 52.222-37 Employment Reports on Special Disabled Veterans, Veterans of the Vietnam Era, and other eligible Veterans (SEP 2006); 52.222-39 Notification of Employee Rights Concerning Payment of Union Dues or Fees (DEC 2004); 52.225-1 Buy American Act - Supplies (JUN 2003) 52.225-13 Restrictions on Certain Foreign Purchases (FEB 2006) 52.232-33 Payment by Electronic Funds Transfer - Central Contractor Registration (OCT 2003); Additional Contract Requirements or Terms and Conditions: 52.214-34 Submission of Offers in the English Language (APR 1991); 55.214-35 Submission of Offers in U.S. Currency (APR 1991); 52.217-5 Evaluation of Option (JUL 1990); 52.217-7 Option for Increased Quantity - Separately Priced Line Item (MAR 1989) Fill in: within 60 days from time of installation. The following Clause applies only to option items, CLINs 0002 through 0008: 52.232-19 Availability of Funds for Next Fiscal Year (APR 1984) Fill in: September 30, 2007. 14. Offers shall be submitted to: NOAA, Mountain Region Acquisition, Attn: Diana Romero, 325 Broadway, Boulder, CO 80305-3328 or by email:
[email protected] or by fax: 303-497-3163. Offers are due in the contracting office no later than 3:00 p.m. Mountain Time on September 7, 2007. 15. Point of Contract: Purchasing Agent, Diana Romero, telephone number (303) 297-3761; email:
[email protected].