66--USED WAFER SUBSTRATE BONDER

This is a modification to the synopsis entitled Used Wafer Substrate Bonder which was posted on July 28, 2005. You are notified that the following changes are made: This synopsis is being cancelled. NASA anticipates re-advertising for new substrate bonders. Documents related to this procurement will be available over the Internet. These documents will reside on a World Wide Web (WWW) server, which may be accessed using a WWW browser application. The Internet site, or URL, for the NASA/GSFC Business Opportunities home page is http://prod.nais.nasa.gov/cgi-bin/eps/bizops.cgi?gr=D&pin=51 Offerors are responsible for monitoring this site for the release of the solicitation and any amendments. Potential offerors are responsible for downloading their own copy of the solicitation and amendments (if any). [INSERT ANY APPLICABLE NOTES]