59--DIGITAL WEDGE BONDER

NASA/GSFC has a requirement for a digital wedge-type wire bonder with the following features: - Automatic step-back, automatic second bond mode, Capability of bonding aluminum wire and gold wire, Microscope package, 4" wafer chuck, Electrostatic discharge package, and Digital parameter controller with receipe storage This requirement is NOT being handled as a small business set-aside. This notice is a combined synopsis/solicitation for commercial items prepared in accordance with the format in FAR Subpart 12.6, as supplemented with additional information included in this notice. This announcement constitutes the only solicitation, which is issued as a Request for Quotation (RFQ); quotes are being requested and a written solicitation will not be issued. Offerors are required to use the On-Line RFQ system to submit their quote. The On-line RFQ system is linked above or it may be accessed at http://prod.nais.nasa.gov/cgi-bin/eps/bizops.cgi?gr=C&pin= . The information required by FAR Subpart 12.6 is included in the on-line RFQ. The Government intends to acquire a commercial item using FAR Part 12 and the Simplified Acquisition Procedures set forth in FAR Part 13. Questions regarding this acquisition must be submitted in writing (e-mail is preferred) no later than August 12, 2005. It is the quoter's responsibility to monitor this site for the release of amendments (if any). Potential quoters will be responsible for downloading their own copy of this notice, the on-line RFQ and amendments (if any). An ombudsman has been appointed - See NASA Specific Note "B". Any referenced notes may be viewed at the following URLs link below. http://genesis.gsfc.nasa.gov/nasanote.html