Integrated Multicomponent Module for Quantum Sensors

Objective: Develop one or more multicomponent prototypes realizing a commercially viable quantum-sensor-related component in an integrated module. Description: The DoW needs quantum sensing capabilities that are Size, Weight, and Power (SWaP) compatible with a broad range of vehicles and platforms, and it seeks to develop commercial, off-the-shelf (COTS) components with integrated capabilities that currently hinder low-SWAP quantum sensors. Such COTS components could provide multiple advantages: Integrating capability for use in different sensor designs across the quantum industry Accelerating the development of low SWaP, low-cost quantum sensors by focusing resources on COTS solutions that currently hinder such development from custom, discrete approaches Expanding dual-use market opportunities through commercial application of such COTS components individually and by enabling quantum sensors with more attractive price points for commercial markets Providing initial steps needed for eventual standardization of quantum technologies and quantum support devices targeting the most mature quantum technology currently available, i.e., quantum sensors Attracting non-quantum commercial companies to leverage their expertise in microelectronic device manufacturing Proposed approaches should target capabilities needed for supporting quantum device operation broadly needed in the quantum sensor community with the result of lowering overall SWaP and cost of such sensors. They should carefully consider the expected market potential for selling the resulting component to the quantum community and potentially beyond to non-quantum DoW and commercial markets. The mix of component technologies that enable quantum devices should account for such market potential and be key elements in reducing the SWAP of overall quantum sensors. Proposed solutions could leverage, but they are not limited to, photonic integrated circuits (PICs), microcells, and solid-state technologies like color centers, silicon nitride (SiN), and thin film lithium niobate (TFLN) to enable the production of compact and robust light sources, isolators, modulators, and other components used to realize quantum sensing, computing, and networking capabilities. These components are still largely produced in isolation, incurring performance losses due to interfacing issues such as fiber insertion loss or reflection at waveguide facets. Directly integrating these components onto (e.g.) a single substrate can reduce the losses resulting from internal interfaces and enable reduced form-factors, but they must balance a need for the modularity that enables reuse and accelerates innovation. Keywords: Quantum; Photonic Integrated Circuit; Silicon Nitride; SiN; Thin Film Lithium Niobate; TFLN; critical quantum components; quantum sensors; low-SWaP quantum devices; quantum manufacturing CMMC Level: Level 1