DARPA
To develop next generation microelectronics design and integration approaches that simultaneously result in resilience to ionizing radiation and enhanced security. | Tech Office: Microsystems Technology | Topic #: DPA26BZ01-NV009 | Announcement: STTR
DARPA
To develop a manufacturable mixed-signal integrated circuit (IC) technology capable of reliable operation in harsh environments, specifically high-temperature conditions up to 800°C. | Acronym: THERMAL | Tech Office: Microsystems Technology | Topic #: DPA26BZ01-NV008 | Announcement: STTR
DARPA
Develop and demonstrate wideband, power-efficient and tunable radio frequency (RF) filter technologies that significantly improve spectrum access and signal integrity for Department of War (DoW) communications and electronic warfare (EW) systems | Tech Office: Microsystems Technology | Topic #: DPA2